Title:
CURABLE RESIN COMPOSITION AND PROTECTIVE FILM
Document Type and Number:
Japanese Patent JP2005036092
Kind Code:
A
Abstract:
To provide a curable resin composition having excellent storage stability, and a protective film having excellent chemical resistance, particularly resistance to alkalis.
The curable resin composition comprises a component (A) of a polymer obtained by the addition polymerization of a monomer having a cyclic ether group (an epoxy group and/or an oxetanyl group) and an olefinic double bond and a component (B) of a heat cationic curing catalyst. The protective film is obtained by coating the curable resin composition on an adherend and heat-curing the coated film at ≥190°C.
Inventors:
KAWAGUCHI YUJIRO
HASEGAWA TOSHIYUKI
HASEGAWA TOSHIYUKI
Application Number:
JP2003201612A
Publication Date:
February 10, 2005
Filing Date:
July 25, 2003
Export Citation:
Assignee:
SUMITOMO CHEMICAL CO
International Classes:
B32B7/10; C08G59/68; C08G65/18; C09D125/08; C09D133/00; C09D133/14; C09D157/10; C09D171/00; (IPC1-7): C08G59/68; B32B7/10; C08G65/18; C09D125/08; C09D133/00; C09D133/14; C09D157/10; C09D171/00
Attorney, Agent or Firm:
Takashi Kuboyama
Toru Nakayama
Masayuki Enomoto
Toru Nakayama
Masayuki Enomoto