CURABLE RESIN COMPOSITION AND PROTECTIVE FILM FORMED USING THE COMPOSITION

Japanese Patent JP2005179650

A

To provide a curable resin composition capable of forming a protective film with excellent flatness, the protective film formed using the curable resin composition and a process for its production.

The curable resin composition comprises below components (A) and (B). (A) is a polymer prepared by addition polymerization of a monomer having a cyclic ether group and an olefinic double bond. (B) is a 6C or less cyclic ester compound. The curable resin composition comprises below mentioned components (A') and (B). (A') is a polymer prepared by addition polymerization of a monomer having a cyclic ether group and an olefinic double bond, and at least one monomer selected from the group consisting of a (meth)acrylic monomer and a styrenic monomer. (B) is a 6C or less cyclic ester compound. The protective film is formed using the curable resin composition and is produced by spreading the curable resin composition on a subject to be coated followed by heat curing.

JP6477475	Fiber-forming composition and biocompatible material using the fiber
JPH08239540	COMPOSITION HAVING ELECTRICAL CONDUCTIVITY
WO/2010/079681	CROSSLINKED POLYMER AND CROSSLINKED POLYMER PRODUCTION METHOD

KAWAGUCHI YUJIRO

JP2004338630A

July 07, 2005

November 24, 2004

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SUMITOMO CHEMICAL CO

C08L33/14; C08K5/00; C08K5/151; C08L63/10; C09D7/12; C09D125/02; C09D133/00; C09D163/00; C09D201/06; (IPC1-7): C08L33/14; C08K5/00; C08K5/151; C08L63/10; C09D7/12; C09D125/02; C09D133/00; C09D163/00; C09D201/06

JP2005047945A	2005-02-24
JP2002332344A	2002-11-22
JP2003201305A	2003-07-18
JPS59199712A	1984-11-12
JP2000131519A	2000-05-12
JPH06136239A	1994-05-17
JPH11209561A	1999-08-03
JPH06157716A	1994-06-07

Takashi Kuboyama
Toru Nakayama
Masayuki Enomoto

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