Title:
CURABLE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP08092333
Kind Code:
A
Abstract:
PURPOSE: To obtain the subject composition having rapid development of strength at ordinary temperature, capable of providing a cured material hardly having residual styrene, excellent in impact resistance and toughness and useful as a lining material.
CONSTITUTION: This composition contains (A) 100 pts.wt. of a resin composition consisting of (i) 30-75wt.% of a modified butadiene-acrylonitrile copolymer having a (meth)acryloyl group or a vinyl group at the end and (ii) 25-70wt.% of a radically polymerizable unsaturated monomer, (B) 0.05-5 pts.wt. of amines of the formula [R1 is H, CH3 or C2H5; R2 is CnH2n; (n) is 1-5] (e.g. N- phenylethanolamine) and (C) 0.5-10 pts.wt. of a diacylperoxide (e.g. lauroyl peroxide).
Inventors:
Maeda, Takeshi
Arai, Masami
Uda, Hiroshi
Kato, Tamiyoshi
Arai, Masami
Uda, Hiroshi
Kato, Tamiyoshi
Application Number:
JP1994000226810
Publication Date:
April 09, 1996
Filing Date:
September 21, 1994
Export Citation:
Assignee:
SHOWA HIGHPOLYMER CO LTD
International Classes:
C08F4/40; C08F290/00; C08F290/04; C08F290/06; C08F4/00; C08F290/00; (IPC1-7): C08F290/06; C08F4/40
