Title:
CURABLE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2001279101
Kind Code:
A
Abstract:
To obtain a curable resin composition which is excellent in the mechanical characteristics such as strengths, toughness and so on and also which has the excellent weatherability as well as the high light transmittance.
This curable resin composition comprises a resin composition which contains (A) 1-90 wt.% of a particle-form polymer having an average particle diameter of 20-500 nm and an iodine value of 100 or less and (B) 10-99 wt.% of a curable resin and which has (A) component being dispersed in the shape of particles, not being compatible with, in component (B).
Inventors:
UENO TOMIKAZU
NISHIWAKI ITSUO
MIYATA TSUNEMITSU
KOSHIMURA KATSUO
NISHIWAKI ITSUO
MIYATA TSUNEMITSU
KOSHIMURA KATSUO
Application Number:
JP2000098426A
Publication Date:
October 10, 2001
Filing Date:
March 31, 2000
Export Citation:
Assignee:
JSR CORP
International Classes:
C08L101/00; (IPC1-7): C08L101/00
Attorney, Agent or Firm:
Toshiaki Fukuzawa