Title:
CURABLE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2002146216
Kind Code:
A
Abstract:
To obtain a curable resin composition comprising an organic polymer having a reactive silicon group, the composition maintaining good residual surface tackiness and adhesion to a material, while being able to realize good coating adhesion.
This curable resin composition comprises (a) 100 pts.wt. of an organic polymer having at least one reactive silicon group in the molecule, and (b) 10-40 pts.wt. of an alkylaryl sulfonamide.
Inventors:
FUKUNAGA ATSUSHI
KONDO KENSUKE
KONDO KENSUKE
Application Number:
JP2000339283A
Publication Date:
May 22, 2002
Filing Date:
November 07, 2000
Export Citation:
Assignee:
KANEGAFUCHI CHEMICAL IND
International Classes:
C08L101/10; C08K5/435; (IPC1-7): C08L101/10; C08K5/435
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