CURABLE RESIN COMPOSITION

Japanese Patent JP2007119720

A

To provide a curable resin composition that has satisfactory thermal resistance, surface hardness, anti-sputtering property, low degassing property and shows good patterning property.

The curable resin composition is represented by general formula (1) and is a copolymer comprising a polymerizable compound having an acid value of more than 30 mg KOH/g, a polymerizable unsaturated compound a having a glass transition point higher than 150°C when the polymer is regarded as a homopolymer, and a polymerizable unsaturated compound b bearing epoxy group or its group moiety, the weight-average molecular weight is ≥10,000 and contains an epoxy resin having no carboxylic acid group at the terminal, polyfunctional monomers and a photo-polymerization initiator.

JPH09501729	INDUSTRIAL APPLICABILITY: Silicone-grafted thermoplastic elastomer copolymer and hair and skin care composition containing the same.
JP5566002	Pendant Acrylate-and / or Methacrylate-Containing Polyester Monool and Polyester
JP6722976	Polyrotaxane crosslinked polymer and its aqueous dispersion

TAWARAYA SEIJI
KAWAGUCHI SHUJI
BABA YASUKO
SUMINO TOMONOBU
KOYAMA MINAMI
NAKAYAMA YOSHIMITSU

JP2006143179A

May 17, 2007

May 23, 2006

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DAINIPPON PRINTING CO LTD
INCTEC INC

C08F290/14; C08G59/32; C08G59/42; G02B5/20; G03F7/027; G03F7/038

JPH0952938A	1997-02-25
JP2002206014A	2002-07-26
JPH05339356A	1993-12-21
JP2002088136A	2002-03-27
JP2005017321A	2005-01-20

Akihiko Yamashita
Kishimoto Tatsuto

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