To provide a curable resin composition producing an insulating film for a circuit board having good electrical properties and excellent flame retardancy.

The curable resin composition includes a cyclic olefin polymer and a curing agent. The cyclic olefin polymer is, for example, a polymer obtained by the ring opening polymerization using a fluorine-containing cyclic olefin compound as at least a part of a monomer, or a hydrogenated product thereof. Such a fluorine containing cyclic olefin compound is easily synthesized by Diels-Alder reaction to add 1-3 molecules of cyclopentadiene to a molecule of a fluorine-containing monocyclic olefin wherein a hydrogen atom is replaced by a fluorine atom or a trifluoromethyl group. The curable resin composition has a functional group forming a bond by reaction with a curing agent.

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