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Patent Searching and Data


Title:
CURABLE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2013010938
Kind Code:
A
Abstract:

To provide a curable resin composition with which a coating film and a pattern excellent in heat resistance can be formed.

The curable resin composition includes: (A) an addition polymer including a structural unit derived from at least one selected from the group consisting of an unsaturated carboxylic acid and an unsaturated carboxylic acid anhydride and a structural unit derived from an unsaturated compound having an oxiranyl group; (B) a compound having at least one group selected from the group consisting of an acryloyl group and a methacryloyl group; (C) a polymerization initiator; and (D) a compound represented by formula (1) [in the formula, R1 represents a benzyl group or a 2-5C cyano alkyl group].


Inventors:
Shirakawa, Masakazu
Application Number:
JP2012000117864
Publication Date:
January 17, 2013
Filing Date:
May 23, 2012
Export Citation:
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Assignee:
SUMITOMO CHEMICAL CO LTD
International Classes:
C08G59/20; G03F7/004; G03F7/027
Domestic Patent References:
JPH0952938A1997-02-25
JP2007182539A2007-07-19
JP2009149854A2009-07-09
JP2008266570A2008-11-06
JPH05222165A1993-08-31
Foreign References:
WO2008139679A12008-11-20
Attorney, Agent or Firm:
田中 光雄
山田 卓二
森住 憲一
梶田 真理奈