Title:
CURABLE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2015157912
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a composition which has appropriate workability as a curable resin composition used in sealing applications, e.g. sealing of on-site formation of a gasket, and desirable thixotropy.SOLUTION: A curable resin composition comprises (A) 100 pts. mass of an acrylic monomer which is 5-18C in principal chain and has a monofunctional chain alkyl skeletal structure, (B) 15-45 pts. mass of a PTFE filler, (C) 0.01-5 pts. mass of photoinitiator and (D) 1-10 pts. mass of a thermoplastic elastomer.
Inventors:
KAMAKURA HAYATO
NAKAMURA MOEKO
NAKAMURA MOEKO
Application Number:
JP2014033724A
Publication Date:
September 03, 2015
Filing Date:
February 25, 2014
Export Citation:
Assignee:
THREE BOND CO LTD
International Classes:
C08F2/48; C08F2/44; C08F259/08; C08F291/00; C08L21/00; C08L27/18; C08L33/00
Domestic Patent References:
| JP2007169463A | 2007-07-05 | |||
| JP2011052134A | 2011-03-17 | |||
| JP2005302564A | 2005-10-27 | |||
| JP2007169463A | 2007-07-05 | |||
| JP2011052134A | 2011-03-17 | |||
| JP2005302564A | 2005-10-27 |
Foreign References:
| WO2013161402A1 | 2013-10-31 | |||
| WO2013161402A1 | 2013-10-31 |