Title:
CURABLE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2023081061
Kind Code:
A
Abstract:
To provide a curable resin composition that impregnates a base material easily in preparing a substrate and satisfies all of sufficient low dielectric characteristics, a low linear expansion coefficient, and high copper foil adhesive strength of a cured product.SOLUTION: A curable resin composition contains (A) modified polyphenylene ether, (B) styrene-based elastomer, and (C) a cross-linking auxiliary represented by formula (18), which is an aromatic vinyl compound having three or less vinyl groups in the molecule. The curable resin composition has a solution viscosity of a toluene solution of 62% solid concentration of 1-7,000 [mPa s] as measured with a cone plate type rotary viscometer.SELECTED DRAWING: None
Inventors:
YAMAMOTO HISANAO
FUKUOKA HIROTSUGU
FUKUOKA HIROTSUGU
Application Number:
JP2021194740A
Publication Date:
June 09, 2023
Filing Date:
November 30, 2021
Export Citation:
Assignee:
ASAHI KASEI CORP
International Classes:
B32B27/28; C08L71/12; B32B27/30; C08F290/06; C08G65/48; C08J5/24; C08K5/01; C08L9/06; C08L53/02
Attorney, Agent or Firm:
Atsushi Aoki
Shinji Mihashi
Kazuhiro Nakamura
Miyako Saito
Shunsuke Sanma
Shinji Mihashi
Kazuhiro Nakamura
Miyako Saito
Shunsuke Sanma
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