CURABLE RESIN COMPOSITION

Japanese Patent JPH03281650

A

PURPOSE:To prepare the title compsn. showing a low shrinkage during curing and giving a cured article having high glass transition point and excellent resistance to water, heat, and thermal shock and dielectric properties by compounding a specific copolymer with a thermoset resin and/or a vinyl monomer. CONSTITUTION:The title compsn. is prepd. by compounding a copolymer of a formula: X(O-Y)n [wherein X is a conjugated diene polymer block; Y is an N-substd. maleimide polymer block; (n) is 1-5; Y is bonded to the molecule of X through an ether bond; and the wt. ratio of X to Y is (20:80) to (90:10)] having a number average mol.wt. of 500-100000 with a thermoset resin and/or a vinyl monomer (e.g. a cresol novolac epoxy resin). An example of the copolymer is one obtd. by copolymerizing butadiene with isoprene in the presence of n-butyllithium, reacting the resulting copolymer with ethylene oxide to give a conjugated diene polymer having an O-Li bond at one molecular end, and reacting the diene polymer with N-phenylmaleimide.

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MURAMOTO HIROO
KIMURA KIMIHARU
MATSUMOTO HITOSHI

JP8081090A

December 12, 1991

March 30, 1990

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NIPPON SODA CO

C08L53/00; C08F285/00; C08F287/00; C08F293/00; C08F297/00; C08K5/16; C08L47/00; C08L51/00; C08L63/00; C08L101/00; (IPC1-7): C08F287/00; C08F293/00; C08L53/00; C08L101/00

Yoshimi Yokoyama (1 person outside)

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