Title:
CURABLE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH04146911
Kind Code:
A
Abstract:
PURPOSE:To obtain a curable resin composition excellent in mechanical strengths, heat resistance, humidity resistance, heat shock resistance and electrical properties and reduced in heat-curing shrinkage by mixing a specified polymer comprising a conjugated diene polymer block and an N-substituted maleimide polymer with a maleimide compound and a polyallyl compound. CONSTITUTION:A curable resin composition is prepared by mixing copolymer (A) represented by the formulas X(Y)m and/or X(O-Y)n [wherein X is a conjugated diene polymer block or a block of a copolymer of a conjugated diene with a vinyl monomer; Y is a block of a polymer of an N-substituted maleimide of the formula (wherein R is 1-20 C alkyl, aryl or the like), m is 1 or 2; and n is 1-5] and having an X/Y weight ratio in the range of 20/80<=X/Y<=90/10 and a number-average molecular weight of 500-100000 with a compound (B) having at least one meleimido group in the molecule (e.g. diphenylmethane- bismaleimide) and a polyallyl compound (C) having at least two allyl groups in the molecule (e.g. diallylbisphenol) in such amounts that 90/10>=B/C>=10/90 and 90/10>=A/(B+C)>=10/90.
Inventors:
MURAMOTO HIROO
KIMURA KIMIHARU
MATSUMOTO HITOSHI
KURAYAMA ISAO
KIMURA KIMIHARU
MATSUMOTO HITOSHI
KURAYAMA ISAO
Application Number:
JP27044390A
Publication Date:
May 20, 1992
Filing Date:
October 11, 1990
Export Citation:
Assignee:
NIPPON SODA CO
International Classes:
C08F287/00; C08F285/00; C08F290/00; C08F299/00; (IPC1-7): C08F287/00; C08F299/00
Attorney, Agent or Firm:
Yoshimi Yokoyama (1 person outside)