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Patent Searching and Data


Title:
CURABLE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH04351627
Kind Code:
A
Abstract:
PURPOSE:To improve toughness, heat resistance, mechanical strengths, and water resistance by compounding a specific epoxy compd., a polyethersulfone, an arom. amine curative, and a radical polymn. initiator. CONSTITUTION:A condensate obtd. by condensing bisphenol A with N- methylolamide in the presence of an acid catalyst is reacted with epichlorohydrin in the presence of a phase transfer catalyst and dehydrohalogenated with an alkali to give an epoxy compd. of formula I (wherein R is H or methyl; and n and n' are each 0-2 provided that at least one of them is 1 or higher). 100 pts. wt. the epoxy compd., 5-100 pts.wt. polyethersulfone of formula II (wherein X is a group selected from those of formulas III to VII), an arom. amine curative in an amt. of 0.5-2.0 amine equivalent based on 1 equivalent of epoxy groups, and 0.1-10 pts.wt. radical polymn. initiator are compounded.

Inventors:
KURIMOTO KENJI
NAKAMURA MASAAKI
FUJIMOTO KAZUHIDE
HAYASHI TAKAYUKI
ASADA MASAHIRO
Application Number:
JP15571791A
Publication Date:
December 07, 1992
Filing Date:
May 29, 1991
Export Citation:
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Assignee:
KANEGAFUCHI CHEMICAL IND
International Classes:
C08G59/20; C08G59/00; C08G59/28; C08G59/50; C08L63/00; C08L81/00; C08L81/06; (IPC1-7): C08G59/20; C08G59/50; C08L63/00; C08L81/06
Attorney, Agent or Firm:
Kenji Itami