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Patent Searching and Data


Title:
CURABLE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH11310696
Kind Code:
A
Abstract:

To obtain the subject composition capable of forming a cured resin excellent in resistances to weather and discoloration and useful in applications requiring the resistance to weather by adding a specific amount of a specified benzoate compound to a reactive silicon group-containing organic polymer.

This composition is obtained by adding (B) 0.01-5 pts.wt. of a compound represented by the formula [R1 and R2 are each H, a 1-8C (cyclo) alkyl, a 6-12C (alkyl)aryl or a 6-12C arylalkyl; R3 is a 1-30C alkyl, a 6-30C (alkyl)aryl or a 6-30C arylalkyl] (e.g. hexadecyl 4-hydroxy-3,5-di-t-butylbenzoate) and, as necessary, further (C) a hindered amine-based light stabilizer (e.g. 2,2,6,6- tetramethyl-4-piperidyl stearate) to (A) 100 pts.wt. of a reactive silicon group- containing organic polymer.


Inventors:
YOSHIKAWA KAZUMI
KONO TOSHINORI
FUKUSHIMA MITSURU
FUKUDA ATSUSHI
Application Number:
JP13265598A
Publication Date:
November 09, 1999
Filing Date:
April 27, 1998
Export Citation:
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Assignee:
ASAHI DENKA KOGYO KK
International Classes:
C08K5/13; C08K5/17; C08L71/00; C08L101/10; (IPC1-7): C08L71/00; C08K5/13; C08K5/17; C08L101/10
Attorney, Agent or Firm:
Yoshikazu Miura