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Title:
CURABLE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPS56141314
Kind Code:
A
Abstract:

PURPOSE: To prepare the titled composition giving a cured product having excellent heat resistance, and suitable as a raw material of surface-protecting paint, casting resin, molding resin, and impregnating resin, by compounding a specific unsaturated compound, a polymerizable unsaturated compound, etc.

CONSTITUTION: The composition is prepared by compounding (A) 95W50pts.wt. of an unsaturated compound of formula [R1 is H of methyl; R2 is glycol residue or a straight-chain polyester oligomer residue of formula -(R'-COO-R"-COO)m-R'-(R' is glycol residue; R" is dibasic acid residue; m is 1W20); R3 is diisocyanate residue; n is 1W10], (B) 5W50pts.wt. of a compound having one or more polymerizable unsaturated groups in a molecule [e.g. (meth)acrylic acid (ester)], and (C) 0W 10pts.wt. of a radical polymerization initiator and/or a photosensitizer.


Inventors:
OKADA TAISUKE
AIMONO YUUJI
Application Number:
JP4409480A
Publication Date:
November 05, 1981
Filing Date:
April 03, 1980
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08F2/50; C08F2/00; C08F290/00; C08F299/00; C08F299/06; (IPC1-7): C08F2/50; C08F299/06



 
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