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Patent Searching and Data


Title:
CURABLE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPS60195127
Kind Code:
A
Abstract:

PURPOSE: To obtain a composition of outstanding long-term storage stability capable of giving tough cured products through readily curing by light or organic peroxide, by incorporating polythiol in a blend of diallylidene pentaerythrit and oligo(meth)acrylate.

CONSTITUTION: The objective composition can be obtained by incorporating a blend of (A) diallylidene pentaerythrit and (B) origo(meth)acrylate with a molecular weight ≥300, having in one molecule at least two (meth)acryloyl groups with (C) a polythiol in such an amount as to correspond to 0.1W1.5 equivalent of the thiol group per equivalent of the unsaturated bond in said blend. The component (B) is, e.g. a vinyl ester, urethane-acrylate resin. The component (C) is e.g. a pentaerythrit tetrathioglycolate.


Inventors:
TAKIYAMA EIICHIROU
MORITA KATSUHISA
TAKANO SEIICHI
Application Number:
JP5112084A
Publication Date:
October 03, 1985
Filing Date:
March 19, 1984
Export Citation:
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Assignee:
SHOWA HIGHPOLYMER
International Classes:
C08G75/00; C08G75/02; C08G75/04; C08G75/045; (IPC1-7): C08G75/04
Domestic Patent References:
JPS56116001A1981-09-11
JPS56116002A1981-09-11
JPS60110725A1985-06-17
Attorney, Agent or Firm:
Soga Doteru