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Patent Searching and Data


Title:
CURABLE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPS6210103
Kind Code:
A
Abstract:

PURPOSE: The titled composition which can cure into a flexible film within a short time by irradiation with light, heating or the like, comprising a PVA resin of a block character above a specified value, a polymerizable vinyl compound and a polymerization initiator.

CONSTITUTION: A curable resin composition containing a PVA resin (A) of a block character [η] ≥0.55 (preferably, one having a block character ≥0.60, a degree of saponification of 30W95mol%, and a degree of polymerization of 200W2,000), a polymerizable vinyl compound (B) [e.g., hydroxyalkyl (meth) acrylate] and a polymerization initiator (C) (e.g., a benzoin compound). By using resin A having a block character ≥0.55, this composition can cure into a film rich in flexibility within a short time by irradiation with light or heating. This composition is useful for paints, adhesives, molding materials and printing board materials.


Inventors:
MARUHASHI KIICHI
OISHI TSUKASA
Application Number:
JP14898185A
Publication Date:
January 19, 1987
Filing Date:
July 05, 1985
Export Citation:
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Assignee:
NIPPON SYNTHETIC CHEM IND
International Classes:
C08F261/00; C08F2/44; C08F261/04; G03F7/004; G03F7/032; G03F7/033; G03F7/038; (IPC1-7): C08F2/44; C08F261/04; G03F7/10
Domestic Patent References:
JPS4717452A
JPS50155554A1975-12-15
JPS56131609A1981-10-15
JPS57117569A1982-07-22