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Patent Searching and Data


Title:
CURABLE SILICONE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2014019798
Kind Code:
A
Abstract:

To provide a silicone resin composition providing a cured product having high refractive index and excellent mechanical characteristics, and characteristic to avoid breakage even in the oppressive thermal cycle test, while keeping high transparency and excellent thermal resistance of a MQ resin.

A curable silicone resin composition contains (A) an aromatic group-containing organopolysiloxane having 2 or more alkenyl groups in a molecule and viscosity at 25°C of 10 to 1,000,000 mPa s, (B) an organopolysiloxane with a resin structure containing 10 to 80 mol% of a SiO4/2 unit, 1 to 80 mol% of a (R1)2SiO2/2 unit and 1 to 60 mol% of a (R2)3SiO1/2 unit and 0.1 to 5.0 mol% of SiOH group in a molecule, (C) an organohydrogenpolysiloxane having 2 or more hydrogen atoms bound to silicon atom in a molecule and in which 20 to 80 mol% of all substituents bound to silicon atom is a phenyl group and the SiO4/2 unit is 5 mol% ore less, and (D) a platinum group metal based catalyst, and 20 to 80 mass% of the (B) component based on total of the (A) component and the (B) component is contained.


Inventors:
MIZUNASHI TOMOYUKI
KASHIWAGI TSUTOMU
KODAMA KINYA
Application Number:
JP2012160123A
Publication Date:
February 03, 2014
Filing Date:
July 19, 2012
Export Citation:
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Assignee:
SHINETSU CHEMICAL CO
International Classes:
C08G77/20; C08G77/12; C08G77/16; C08K3/16; C08L83/05; C08L83/07
Attorney, Agent or Firm:
Mikio Yoshimiya