Title:
CURE ACCELERATOR FOR THERMOSETTING RESIN AND THERMOSETTING RESIN CONTAINING THE SAME
Document Type and Number:
Japanese Patent JP3632935
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a cure accelerator which is always useful for curing various resin systems, especially epoxy and maleimide resins, and does not take such an equilibrated state as to accelerate a curing reaction except during a curing reaction and to provide a thermosetting resin composition containing the same and having excellent curability and good room temperature storage stability.
SOLUTION: A maleimide compound having at least one maleimido group in the molecule, a iris-substituted organophosphine and a proton donor having at least one releasable proton in the molecule are reacted with each other in a solvent in which all of the reactants are soluble to obtain a cure accelerator for a thermosetting resin. This accelerator is added to a thermosetting resin to obtain a thermosetting resin composition.
Inventors:
Hiromi Honda
Sumiya Miyake
Sumiya Miyake
Application Number:
JP27583395A
Publication Date:
March 30, 2005
Filing Date:
October 24, 1995
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
C08K5/50; C08F8/00; C08F20/40; C08F22/36; C08F22/40; C08G59/40; C08G59/42; C08G59/50; C08G59/62; C08L33/24; C08L35/00; C08L101/00; (IPC1-7): C08G59/40; C08F22/40; C08K5/50; C08L101/00
Domestic Patent References:
| JP2092921A |