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Title:
CURING ADHESIVE MATERIAL
Document Type and Number:
Japanese Patent JP2003306655
Kind Code:
A
Abstract:

To obtain an adhesive material which has excellent solubility, heat stability and initial adhesive power, high workability and adhesive strength due to rapid progress of cationic polymerization up to a desired polymerization degree and to provide an adhesion method using the material.

The curing adhesive material comprises an acid generator (A) consisting of an onium cation and a borate anion represented by general formula (1) [BymZn]- (Y is fluorine or chlorine; Z is a phenyl group substituted with at least two or more electron attractive groups selected from fluorine, a cyano group, a nitro group and a trifluoromethyl group; m is an integer of 0-3; n is an integer of 1-4; m+n is 4), an adhesive polymer (B) and a cationically polymerizable compound (C).


Inventors:
UESUGI TAKAHIKO
Application Number:
JP2002111563A
Publication Date:
October 31, 2003
Filing Date:
April 15, 2002
Export Citation:
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Assignee:
TOYO INK MFG CO
International Classes:
C08F2/44; C08F2/46; C08F291/00; C09J11/00; C09J201/00; (IPC1-7): C09J11/00; C08F2/44; C08F2/46; C08F291/00; C09J201/00