To provide a curing agent composition giving a thermosetting resin composition having high storage stability and remarkably shortening the time for the complete curing while keeping the fluidity in a mold in the thermal curing of the composition at 100-135°C and provide a thermosetting resin composition containing the curing agent composition, a cured article produced by forming and curing the thermosetting resin composition and a method for producing the molded article.

The curing agent composition is composed of a peroxide expressed by formula (1) (R is a 2-5C straight or branched-chain alkyl) and a peroxide having a 10 hr half-life temperature of 65-90°C. A cured article is produced by using the curing agent composition as a curing agent for a thermosetting resin composition.