Title:
CURING AGENT FOR EPOXY RESIN
Document Type and Number:
Japanese Patent JPH01174520
Kind Code:
A
Abstract:
PURPOSE:To obtain a curing agent for epoxy resins, having excellent compatibility and blending properties with epoxy resins and capable of providing cured products having good curing physical properties, by blending a specific 1- substituted imidazole compound with 2-ethyl-4-methylimidazole. CONSTITUTION:A curing agent for epoxy resins, obtained by blending a 1- substituted imidazole compound expressed by the formula [R1 is 1-6C alkyl; R2 is 1-6C alkyl or group expressed by formula II (R3 is H or 1-4C alkyl)] (e.g., 1-ethyl-2-methylimidazole) with 2-ethyl-4-methylimidazole preferably at <=40wt.% blending ratio of the 1-substituted imidazole compound and having a low viscosity at ambient temperature for a long period. Furthermore, the above-mentioned curing agent is preferably blended in an amount of 0.1-20pts. wt. based on 100pts.wt. epoxy resin for use.
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Inventors:
YAMAZAKI TAKESHI
USUI MASATOSHI
USUI MASATOSHI
Application Number:
JP33256487A
Publication Date:
July 11, 1989
Filing Date:
December 29, 1987
Export Citation:
Assignee:
KOEI CHEMICAL CO
International Classes:
C08G59/50; C08G59/40; (IPC1-7): C08G59/50
Domestic Patent References:
| JPH01117866A | 1989-05-10 |
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