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Patent Searching and Data


Title:
CURING APPARATUS AND CURING METHOD
Document Type and Number:
Japanese Patent JP2005015600
Kind Code:
A
Abstract:

To provide a curing apparatus and a curing method capable of improving the adhesion accuracy between a 1st member and a 2nd member by shortening the curing time of an adhesive.

The curing apparatus 10 functions to fix the 1st member 30 and the 2nd member 34 to each other by curing the adhesive 32. This apparatus 10 comprises a pressing section 40 for supporting the 1st member 30 and pressing the 2nd member 40, a flash light irradiation section 22 for preliminarily curing the adhesive 32 by irradiating the adhesive 32 with flash light of high intensity with short pulses, and an ultraviolet irradiation section 26 for fully curing the adhesive 32 by irradiating the preliminarily cured adhesive 32 with ultraviolet radiation.


Inventors:
MIYASHITA TAKESHI
KATAOKA SEIICHI
Application Number:
JP2003181359A
Publication Date:
January 20, 2005
Filing Date:
June 25, 2003
Export Citation:
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Assignee:
SEIKO EPSON CORP
International Classes:
C09J5/00; (IPC1-7): C09J5/00
Attorney, Agent or Firm:
岡▲崎▼ 信太郎
Arai Zen