Title:
Curing method of resin composition
Document Type and Number:
Japanese Patent JP6331525
Kind Code:
B2
Abstract:
The present invention provides a method with which curing can be carried out in a short time without a heat load on an adherend and a cured product having stable quality can be obtained. The resin composition curing method in accordance with the present invention includes the step (a) of directly and/or indirectly irradiating, with laser light, a resin composition (A) which contains (i) an epoxy resin, (ii) an encapsulated curing agent including a core that contains a curing agent and a shell that covers the core, (iii) a filler, and (iv) a color material.
Inventors:
Seiji Nakajima
Yosuke Tatsuno
Mitsuo Ito
Satoshi Hirono
Mori Saki Yuzo
Hayato Kawamoto
Yosuke Tatsuno
Mitsuo Ito
Satoshi Hirono
Mori Saki Yuzo
Hayato Kawamoto
Application Number:
JP2014052105A
Publication Date:
May 30, 2018
Filing Date:
March 14, 2014
Export Citation:
Assignee:
OMRON Corporation
International Classes:
B32B7/12; C08G59/40; C08K3/36; C08K3/40; C08L63/00; C09J163/00
Domestic Patent References:
| JP2004277701A | ||||
| JP2010144154A | ||||
| JP2007023191A | ||||
| JP7238210A | ||||
| JP2011111570A |
Attorney, Agent or Firm:
Nao Murakami
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