Title:
CURING PROMOTER FOR THERMOSETTING RESIN AND THERMOSETTING RESIN COMPOSITION CONTAINING THE SAME
Document Type and Number:
Japanese Patent JP3729470
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain the subject curing promoter consisting of a compound produced by reaction between an epoxy compound, a tris-substituted organophosphine and a proton donor, exhibiting high curing promotive effect at a temperature higher than the molding temperature range, and excellent in preservability.
SOLUTION: This curing promoter is a compound obtained by reaction between (A) an epoxy compound bearing one or more epoxy groups in one molecule such as glycidyl i-propyl ether, (B) a tris-substituted organophosphine such as trimethylphosphine and (C) an organic compound as a proton donor such as acetic acid, capable of forming an ion pair with a proton acceptor through releasing one or more protons from the molecule. The objective thermosetting resin composition is obtained by blending 100 pts.wt. of a thermosetting resin such as an epoxy resin with 0.3-40 pts.wt. of this promoter.
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Inventors:
Akiko Okubo
Sumiya Miyake
Yoshiyuki Go
Sumiya Miyake
Yoshiyuki Go
Application Number:
JP27111896A
Publication Date:
December 21, 2005
Filing Date:
October 14, 1996
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
C08L63/00; C08G59/68; (IPC1-7): C08G59/68; C08L63/00
Domestic Patent References:
JP47001465A | ||||
JP8041290A | ||||
JP6157624A | ||||
JP5032766A | ||||
JP6157681A | ||||
JP9118719A | ||||
JP5310892A | ||||
JP7252348A |