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Patent Searching and Data


Title:
CURING OF REACTIVE TYPE ADHESIVE, APPARATUS FOR COATING AND CURING AND BONDING
Document Type and Number:
Japanese Patent JP2000086980
Kind Code:
A
Abstract:

To efficiently carry out bonding in a short time and make the curing proceed without any trouble even when a reactive type adhesive is applied to an adherend scarcely transmitting active energy rays by eliminating a time lag from the coating of the reactive type adhesive to irradiation of the active energy rays according to a specific method.

A reactive type adhesive A curable by irradiation of active energy rays is discharged and irradiated with the active energy rays before the adhesive A reaches a bonding surface of an adherend B. Specifically, active energy ray irradiating parts (an irradiating lamp 10 and an optical fiber cable 13) are installed near a discharging outlet of a discharging gun 4 in an apparatus capable of feeding the reactive type adhesive A thermally melted in, e.g. a hot-melt applicator 1 which is a thermally melting part into the discharging gun 4 and then discharging the reactive type adhesive A from the discharging gun 4 to the adherend B. Thereby, the reactive type adhesive A can be irradiated with the active energy rays before the reactive type adhesive A reaches the bonding surface of the adherend B.


Inventors:
YAGI MOTOHIRO
Application Number:
JP25546198A
Publication Date:
March 28, 2000
Filing Date:
September 09, 1998
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
C08J3/28; C09J5/00; C09J163/00; (IPC1-7): C09J5/00; C08J3/28; C09J163/00