Title:
CURING RESIN COMPOSITION AND LAMINATED STRUCTURE CONTAINING CURING RESIN LAYER
Document Type and Number:
Japanese Patent JP2003096143
Kind Code:
A
Abstract:
To provide a curing resin excellent in close adhesion to a base material such as a metal, etc., dried and cured easily at a low temperature, and excellent in adhesion improving effect as a primer.
This curing resin composition contains a crosslinking (meth) acrylic polymer having a radical-polymerizable double bond and a radical- polymerizable monomer containing as an essential component a phosphoric ester monomer having a (meth)acryloyl group.
Inventors:
YOSHIMUNE MASAKI
MIZUTANI TOMOHIRO
MIZUTANI TOMOHIRO
Application Number:
JP2001295890A
Publication Date:
April 03, 2003
Filing Date:
September 27, 2001
Export Citation:
Assignee:
NIPPON CATALYTIC CHEM IND
International Classes:
B32B15/08; B32B15/082; C08F290/04; C08F299/00; C09D4/00; C09D5/00; B32B13/06; (IPC1-7): C08F290/04; B32B13/06; B32B15/08; C08F299/00; C09D4/00; C09D5/00
Attorney, Agent or Firm:
Etsushi Kotani (1 person outside)
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