Title:
CURING SILICONE COMPOSITION
Document Type and Number:
Japanese Patent JP3855041
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a curing silicone composition which cures by a hydrosilylation reaction and a condensation reaction to form a cured material excellent in delustering properties.
SOLUTION: A curing silicone composition which cures by a hydrosilylation reaction and a condensation reaction contains an air oxidation curing unsaturated compound. Examples of this curing silicone composition are those comprising at least (A) a mixture of (a) an organopolysiloxane which contains at least two silicon atom-bonding alkoxy groups in a molecule and no silicon atom- bonding alkenyl groups and (b) an organopolysiloxane which contains at least two silicon atom-bonding alkenyl groups in a molecule and no silicon atom- bonding alkoxy groups or (c) an organopolysiloxane which contains each at least two silicon atom-bonding alkoxy groups and silicon atom-bonding alkenyl groups in a molecule, (B) an organopolysiloxane which contains at least two silicon atom-bonding hydrogen atoms in a molecule, (C) a catalyst for condensation reactions, (D) a Pt-based catalyst and (E) an air oxidation curing unsaturated compound.
Inventors:
Toshiki Nakata
Masayuki Onishi
Masayuki Onishi
Application Number:
JP25626198A
Publication Date:
December 06, 2006
Filing Date:
September 10, 1998
Export Citation:
Assignee:
DOW CORNING CORPORATION
International Classes:
C08L83/05; C08L83/07; C08K5/01; C08K5/09; C08K5/101; C08L83/06; C09J183/06; C09J183/07; (IPC1-7): C08L83/06; C08L83/05; C08L83/07; C09J183/06; //(C08L83/06; C08L91:00; C08L99:00; C08L9:00)
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