Title:
BALL BONDING
Document Type and Number:
Japanese Patent JPH065649
Kind Code:
A
Abstract:
PURPOSE: To provide a ball bonding method, which does never make carbon adhere on a capillary at the time of discharge.
CONSTITUTION: A ball bonding device is constituted into such a structure that in a ball bonding method comprising a step for forming a ball on the point of a wire 2 led out from a capillary 8 by discharge, the discharge is performed while inert gas is sprayed on the vicinity of the point of the wire 2.
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Inventors:
KOBAYASHI YASUSHI
Application Number:
JP16519792A
Publication Date:
January 14, 1994
Filing Date:
June 24, 1992
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
H01L21/60; (IPC1-7): H01L21/60
Attorney, Agent or Firm:
Matsumoto
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