Title:
CURRENT SENSOR WITH STRUCTURE FOR ENGAGING WITH PACKAGING MATERIAL DURING PACKAGING
Document Type and Number:
Japanese Patent JP2023160698
Kind Code:
A
Abstract:
To provide a current sensor which reduces a current sensor-related cost of packaging materials and ensures superior product protection strength during packaging.SOLUTION: A current sensor 100 disclosed herein has roughly cylindrical locking structures 1 to be engaged with male molded parts 4 provided on a packaging material 2. The roughly cylindrical locking structures 1 are provided as a pair across a housing of the current sensor 100 as shown in Figure 1.SELECTED DRAWING: Figure 1
Inventors:
MAKINO TETSUSHI
Application Number:
JP2022082615A
Publication Date:
November 02, 2023
Filing Date:
April 21, 2022
Export Citation:
Assignee:
KOHSHIN ELECTRIC CORP
International Classes:
B65D85/38; G01R15/20