Title:
CURVED SURFACE MACHINING METHOD AND CURVED SURFACE MACHINING DEVICE
Document Type and Number:
Japanese Patent JP3927484
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a curved surface machining method for miniaturizing a device without machining origin deviation due to deviation of a polishing tool and a measuring head and without requiring machining to acquire a positional relation of a machined surface in relation to a coordinate system provided on a machining machine before secondary machining.
SOLUTION: In this method, the machined surface of a workpiece is machined by the machining machine. The polishing tool 1 having a circular arc surface is pressed on the machined surface 21a by fixed load and is scanned. The polishing tool 1 is made to perform a copying operation along the machined surface 21a. At this time, displacement of a pressurizing direction of the polishing tool 1 is acquired by a position sensor constituted of a laser scale body 6 and a laser scale detection head 7. The positional relation of the machined surface 21a in relation to the coordinate system provided on the machining machine is acquired from the displacement of the acquired pressurizing direction. Based on the acquired positional relation, the machined surface 21a is polished by the polishing tool 1.
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Inventors:
Sagae Hidetoshi
Hiroyuki Endo
Hiroyuki Endo
Application Number:
JP2002343989A
Publication Date:
June 06, 2007
Filing Date:
November 27, 2002
Export Citation:
Assignee:
株式会社リコー
International Classes:
B24B13/00; B24B13/04; B24B49/02; (IPC1-7): B24B13/04
Domestic Patent References:
JP63232938A | ||||
JP2002052451A | ||||
JP2002264013A | ||||
JP4083101A | ||||
JP10015800A | ||||
JP63237866A |
Attorney, Agent or Firm:
Hideo Takino