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Title:
CUT-OFF WIRE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
Japanese Patent JP2002292551
Kind Code:
A
Abstract:

To provide a cut-off wire which realizes a long service life and permits high accuracy and high performance, long in size, and inexpensive, and the manufacturing method therefor.

On the base wire 11a, abrasive grains 22a are fixed with bond 22 which consists mainly of a plurality of fluids mixing type adhesive resin which is hardened by mixing a plurality of fluids. The bond 22 may be the plurality of fluid mixing type adhesive resin, either of whose fluids is contained in micro-capsules.


Inventors:
ENOMOTO TOSHIYUKI
TANI YASUHIRO
Application Number:
JP2001099224A
Publication Date:
October 08, 2002
Filing Date:
March 30, 2001
Export Citation:
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Assignee:
RICOH KK
TANI YASUHIRO
International Classes:
B24B27/06; B28D5/04; (IPC1-7): B24B27/06
Attorney, Agent or Firm:
Ariga Gunichiro



 
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