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Title:
CUTTER
Document Type and Number:
Japanese Patent JP2016087790
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a cutter capable of cutting a thick and long metallic plate material, and intercepting vibrations during cutting.SOLUTION: The cutter includes: a frame supporting device equipped with a transport frame; cutting means configured so as to cut a material; a driving member which provides driving force so as to rotate and move the cutting means; a power transmitting device on which the driving member is installed, and which is linked so as to rotate the cutting means or move the cutting means along the transport frame by the driving force of the driving member; and interlocking means configured to synchronize the rotation driving and the movement driving of the cutting means.SELECTED DRAWING: Figure 12

Inventors:
MOON CHANG HO
CHOI KANG HYOUK
NAM HYUN-WOONG
LEE SUNG JIN
CHUN MYUNG SIK
KIM CHINKO
KIM BUNG JIN
LEE MEE HYUN
KIM HONG-KI
Application Number:
JP2015220535A
Publication Date:
May 23, 2016
Filing Date:
November 10, 2015
Export Citation:
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Assignee:
POSCO
International Classes:
B23D47/12; B23D45/02; B23D45/10; B23D47/02; B23D47/04; B23Q1/01; B23Q1/26; B23Q1/58; B23Q3/06; B23Q5/04; B23Q5/22; B23Q11/00
Domestic Patent References:
JPH08290324A1996-11-05
JP2013503762A2013-02-04
JPH03501956A1991-05-09
JPH11207520A1999-08-03
Foreign References:
CN201168830Y2008-12-24
Attorney, Agent or Firm:
Kyosei International Patent Office