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Title:
CUTTING APPARATUS AND CUTTING METHOD
Document Type and Number:
Japanese Patent JP2010036202
Kind Code:
A
Abstract:

To provide a cutting apparatus accurately cutting a plate material such as a heavy and large steel plate without increasing a size of equipment and without extending cycle time.

The cutting apparatus includes: a camera 5 for photographing a reference line marked on a plate material 101; a cutting means 6 for cutting the plate material; a moving operating means for moving/operating the camera 5 and the cutting means 6; and control means 7, 8 which process the image photographed by the camera 5 to detect the positional coordinate of the reference line, and which convert the positional coordinate of the detected reference line to the coordinate system of the cutting means 6 to detect the plate origin coordinate of the plate material 101. The control means 7, 8 cut the plate material 101 with the cutting means 6, based on the plate origin coordinate of the plate material 101, in accordance with the coordinate system of the cutting means 6.


Inventors:
II KENJI
SUZUKI SHUNTARO
Application Number:
JP2008199971A
Publication Date:
February 18, 2010
Filing Date:
August 01, 2008
Export Citation:
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Assignee:
IHI CORP
International Classes:
B23K10/00; B23K7/00; B23K9/127; B23K26/02; B23K26/38; G05B19/404
Domestic Patent References:
JPH0513635A1993-01-22
JPS4816282A
JPS6356380A1988-03-10
JPH0513635A1993-01-22
JPS4816282A
Foreign References:
WO2007049751A12007-05-03
WO2007049751A12007-05-03
Attorney, Agent or Firm:
Hidekazu Miyoshi
Iwa Saki Kokuni
Kawamata Sumio
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu