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Patent Searching and Data


Title:
CUTTING APPARATUS
Document Type and Number:
Japanese Patent JP2011020391
Kind Code:
A
Abstract:

To provide a compact cutting apparatus which surely cuts wooden bulky materials to be cut such as bamboo into chips.

In the cutting apparatus, material to be cut O is caught by a plurality of claws 22e on first conveying mechanism 22 and a plurality of claws 23e on second conveying mechanism 23, conveyed downstream in the conveying direction, while pressed and compressed by planks 22d and 23d, and split (in the lengthwise direction) with the claws 22e and claws 23e. The material to be cut O is then cut lengthwise into strips having a specific width by cutting mechanism 17 installed on the downstream side of the conveying mechanism. The strips of the material to be cut O are pushed out from cutting mechanism 17 are transferred onto lateral cutting mechanism 18. The material to be cut O is cut laterally at right angles to the conveying direction.


Inventors:
UEDA TOSHIHARU
Application Number:
JP2009168479A
Publication Date:
February 03, 2011
Filing Date:
July 17, 2009
Export Citation:
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Assignee:
UEDA IND
International Classes:
B27L11/00; B02C18/14; B02C18/22; B02C21/02; B27L1/04
Attorney, Agent or Firm:
Toshio Okamura