Title:
CUTTING BLADE, AND METHOD AND DEVICE FOR MANUFACTURING ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2013000826
Kind Code:
A
Abstract:
To allow a cutting direction when cutting a ceramic block to be easily controlled.
The cutting blade 1 is formed so that surface roughness of one blade part 2a is finer than surface roughness of the other blade part 2b, and the surface roughness of one blade part 2a is preferably 1.5 times or more as rough as the surface roughness of the other blade part 2b. Also, the surface roughness of the blade parts 2a, 2b is preferably equal to or below 0.2 μm in terms of arithmetic mean roughness. The cutting blade 1 is placed at a cutting position so that when cut, the blade part 2a of the finer surface roughness is pulled by one divided ceramic block 3a.
Inventors:
TANAKA JUNYA
TSUTSUMI HIROTAKA
TSUTSUMI HIROTAKA
Application Number:
JP2011133092A
Publication Date:
January 07, 2013
Filing Date:
June 15, 2011
Export Citation:
Assignee:
MURATA MANUFACTURING CO
International Classes:
B26D1/06; B26D3/00; B28B11/14; H01G4/12; H01G4/30; H01G13/00
Attorney, Agent or Firm:
Kunihiro Yasutoshi
Previous Patent: METHOD OF MANUFACTURING THREE-DIMENSIONAL STRUCTURE, AND THREE-DIMENSIONAL STRUCTURE MANUFACTURED BY...
Next Patent: IMPACT TOOL
Next Patent: IMPACT TOOL