CUTTING BLADE POLISHING QUANTITY CONTROL DEVICE AND METHOD THEREFOR

Title:

CUTTING BLADE POLISHING QUANTITY CONTROL DEVICE AND METHOD THEREFOR

Document Type and Number:

Japanese Patent JPH07136989

Kind Code:

A

Abstract:

PURPOSE: To control the polishing quantity of a cutting blade to the optimum quantity so as to prolong the service life of the cutting blade and a grinding wheel and to stabilize the cutting quality of the cutting blade.

CONSTITUTION: A cutting blade 6 is polished every predetermined polishing cycle by polishing rollers 53a, 54a, and the blade width of the cutting blade 6 is measured every predetermined polishing frequency by a blade width detecting means 60. The measured value of the blade width is fed back to a control device 2, and the polishing time of the cutting blade 6 by the polishing rollers 53a, 54a is controlled to be appropriate. When the polishing time is needed long, it is so judged that the service life of the polishing rollers 53a, 54a came to an end.

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Inventors:

IKUJI TOSHIRO

Application Number:

JP29104293A

Publication Date:

May 30, 1995

Filing Date:

November 19, 1993

Export Citation:

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Assignee:

SHIMA SEIKI MFG

International Classes:

B26D7/12; B24B3/36; B24B49/03; B24B49/10; B26D5/00; (IPC1-7): B26D7/12; B24B49/03; B24B49/10; B26D5/00

Attorney, Agent or Firm:

Keiichiro Nishikyo (2 outside)

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