Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
CUTTING DEPTH ADJUSTING MECHANISM FOR PORTABLE CIRCULAR SAW
Document Type and Number:
Japanese Patent JP2009045730
Kind Code:
A
Abstract:

To provide a portable circular saw with a cutting depth adjusting mechanism for adjusting the cutting depth of a saw blade by tilting a saw blade case around its front side up and down, the cutting depth adjusting mechanism sustaining its well operated condition for a long period by solving the problem that a depth guide is conventionally constructed to enter into the saw blade case, whereby cutting debris thrown up in the saw blade case during cutting is blown directly thereto to cause the malfunction of the mechanism.

The depth guide 15 is arranged outside the saw blade case 22 along the rear part on the side of its back face 22a for adjusting the cutting depth.


More Like This:
JPH05503467INDUSTRIAL APPLICABILITY A device and a method for cutting a large number of pieces from a billet.
JPS6058023BLADE PART ATTACHING STRUCTURE OF AUTOMATIC PRUNING MACHINE
Inventors:
MATSUBARA KOJI
NAKAJIMA TATSUO
AOYAMA SHUJI
Application Number:
JP2007312282A
Publication Date:
March 05, 2009
Filing Date:
December 03, 2007
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MAKITA CORP
International Classes:
B23D47/08; B23D45/16; B27B9/02
Domestic Patent References:
JP2001047401A2001-02-20
JP2006346909A2006-12-28
JP2001096505A2001-04-10
JP2000135623A2000-05-16
JP2006110249A2006-04-27
JP3115333U2005-11-04
JP2001047401A2001-02-20
Attorney, Agent or Firm:
Okada International Patent Office



 
Previous Patent: GRINDING METHOD AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

Next Patent: AIR HOSE