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Title:
CUTTING DEVICE FOR LEAD OF ELECTRONIC PART
Document Type and Number:
Japanese Patent JPH08323529
Kind Code:
A
Abstract:

PURPOSE: To provide a convenient cutting device for leads of electronic parts small in size and capable of cutting the lead of electronic parts in specific length.

CONSTITUTION: A cutting device for lead of electronic parts which is for setting an electronic parts 30 and cutting a lead L of the electronic parts 30, is composed of an electronic part setting unit 10 for setting the electronic parts 30 in a detachable manner, a fixed edge 12, a movable edge 14 engaging with the fixed edge 12 slantwise in order to cut the lead L of the electronic parts 30 set by the electronic part setting unit 10 by means of moving with respect to the fixed edge 12, and a driving means 16 for moving the movable edge 14.


Inventors:
NAGASAWA TERUMITSU
Application Number:
JP15838795A
Publication Date:
December 10, 1996
Filing Date:
June 01, 1995
Export Citation:
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Assignee:
SONY CORP
International Classes:
B23D15/00; B23D17/04; (IPC1-7): B23D15/00; B23D17/04
Attorney, Agent or Firm:
Oka-saki-Shintaro (1 person outside)



 
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