Title:
CUTTING DEVICE AND MANUFACTURING METHOD OF CUT PRODUCT
Document Type and Number:
Japanese Patent JP2023155541
Kind Code:
A
Abstract:
To provide a cutting device which is configured to cut a cut object and enables automatic exchange of a dress board, and to provide a manufacturing method of a cut product.SOLUTION: A cutting device includes a cutting table, a cutting mechanism, a dressing table, a housing mechanism, and a transport mechanism. The cutting tabel holds a cut object. The cutting mechanism cuts the cut object held by the cutting table with a blade. The dressing table holds a dress board for dressing of the blade. The housing mechanism houses multiple dress boards in a stacked manner. The transport mechanism includes: a substrate transport part; and a dress board transport part which may move with the substrate transport part. The substrate transport part suctions the cut object and transports the suctioned cut object to the cutting table. The dress board transport part transports the dress board between the housing mechanism and the dressing table.SELECTED DRAWING: Figure 1
Inventors:
IGUCHI HARUKI
KUWATA SHIORI
HORIMOTO KYOTARO
HOSOMI TAKAYA
KUWATA SHIORI
HORIMOTO KYOTARO
HOSOMI TAKAYA
Application Number:
JP2022064914A
Publication Date:
October 23, 2023
Filing Date:
April 11, 2022
Export Citation:
Assignee:
TOWA CORP
International Classes:
B24B53/00; B24B27/06; B24B53/12; H01L21/301; H01L21/677
Attorney, Agent or Firm:
Kenji Fujiwara
Yuki Kitahara
Yuki Kitahara
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