Title:
CUTTING DEVICE FOR METALLIC THIN PLATE
Document Type and Number:
Japanese Patent JP2021079531
Kind Code:
A
Abstract:
To disclose a cutting device of a metallic thin plate.SOLUTION: A cutting device includes a housing, and an operation space for cutting a metallic thin plate is installed in the housing. A transport belt for transporting the metallic thin plate is installed on a left side on the inside of the operation space, and a cutting mechanism for cutting the metallic thin plate is installed in the operation space. An adjusting mechanism capable of adjusting a cutting angle of the cutting mechanism is installed on a rear side of the cutting mechanism, and a driving space is installed in a left end wall of the operation space. A transmission mechanism for providing motive power is installed in the driving space, with a pressure space provided in the left end wall of the driving space. A press mechanism for pressing and fixing the metallic thin plate is installed in the pressure space. The cutting mechanism includes an adjusting block installed in the operation space, and a sliding space being open downward and communicating with the operation space is installed in the adjusting block.SELECTED DRAWING: Figure 1
Inventors:
BAO XUE'ER
Application Number:
JP2020069096A
Publication Date:
May 27, 2021
Filing Date:
April 07, 2020
Export Citation:
Assignee:
WANG LEI
International Classes:
B23D45/02; B23D19/00; B23D45/14; B23D47/04
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Foreign References:
| KR20160002653A | 2016-01-08 |
Attorney, Agent or Firm:
Kazuhisa Iwanaga