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Title:
CUTTING DEVICE, CUTTING METHOD, AND DISASSEMBLY SYSTEM USING CUTTING DEVICE
Document Type and Number:
Japanese Patent JP2016024022
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a cutting device capable of efficiently performing cutting in a short time, a cutting method, and a disassembly system using the cutting device.SOLUTION: A cutting device has: a laser head for irradiating a construction object with laser beam to soften the construction object; and a cutting part including a blade for cutting the softened construction object, and driving means for hydraulically driving the blade. The blade has a cooling channel inside through which cooling water is circulated.SELECTED DRAWING: Figure 5

Inventors:
KUROSAWA KOICHI
OMORI SHINYA
MORINAKA TADASHI
ISHIZUKA IPPEI
Application Number:
JP2014147729A
Publication Date:
February 08, 2016
Filing Date:
July 18, 2014
Export Citation:
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Assignee:
HITACHI-GE NUCLEAR ENERGY LTD
International Classes:
G21F9/30; B23D17/00; B23D45/00
Domestic Patent References:
JPH1190731A1999-04-06
JPS57205001A1982-12-16
JPS61152345A1986-07-11
JP2002516958A2002-06-11
JP2006038790A2006-02-09
JPS60167744A1985-08-31
JP2013523463A2013-06-17
JPS6072600U1985-05-22
JPH1190731A1999-04-06
JPS57205001A1982-12-16
JPS61152345A1986-07-11
JP2002516958A2002-06-11
JP2006038790A2006-02-09
JPS60167744A1985-08-31
JP2013523463A2013-06-17
Attorney, Agent or Firm:
ポレール特許業務法人