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Title:
CUTTING DEVICE AND METHOD FOR MANUFACTURING LOOP
Document Type and Number:
Japanese Patent JP2010052113
Kind Code:
A
Abstract:

To reduce a removal stock in barrel polishing by conducting bevelling cutting when cutting a large-width cylindrical workpiece into a loop shape having a predetermined width.

The cutting device comprises a circular outer blade 52 and an inner blade 54 having a blade edge formed of a double edge having an angle of 60 to 90 degrees. A workpiece W is cut in a loop shape by mutually moving the outer blade 52 and the inner blade 54 against the workpiece W in a direction orthogonal to a feed direction (a direction of a rotation axis) of the workpiece W so that the blade edges come close to each other, whereby the workpiece W is made to press-contact with the blade edges substantially evenly from both sides of the inner and outer surfaces. Thus, the workpiece W can be broken substantially at the center in the thickness-wise direction thereof, thereby suppressing the formation of burrs. This can eliminate the need to provide the step of removing the burr in a later stage. Furthermore, when a later polishing step of chamfering the cut surface to form a round R shape is provided, shortening a time taken for the polishing step or suppressing the consumption of a grinding stone used in the polishing step can be achieved.


Inventors:
TANIGUCHI TAKAO
IKEDA SHIGEHARU
KATO SUSUMU
MAEDA HIDE
UENO MITSUO
Application Number:
JP2008222043A
Publication Date:
March 11, 2010
Filing Date:
August 29, 2008
Export Citation:
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Assignee:
AISIN AW CO
International Classes:
B23D21/00
Attorney, Agent or Firm:
Aitec International Patent Office