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Title:
CUTTING DEVICE OF PRINTED BOARD AND CUTTING METHOD THEREOF
Document Type and Number:
Japanese Patent JP3608426
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To prevent the burring of a side electrode by providing a drill for cutting the connection part side of a through-hole in a minute distance to partially peel the through-hole, and cutting the connection part by use of a disc-like grinding wheel.
SOLUTION: The connection part 33 side of a through-hole 32 is cut in a minute distance by moving a drill with rotation or moving a master printed board to form a cut part 35 where the through-hole 32 is partially cut. According to this, since the cut part 35 is provided, a side electrode 34a is never burred even if the master printed board is cut by use of a rotating disc-like grinding wheel to form a slit 47. The reason is that the through-hole 32 formed on slave printed boards 31a, 31b is peeled on the connection part 33 side by the cut part 35. No burring is caused on the side electrode 34b side by the same reason.


Inventors:
Hideo Kuse
Akatsuka Terumoto
Kimura Junichi
Haruki Ohwaki
Application Number:
JP1999000102260
Publication Date:
January 12, 2005
Filing Date:
April 09, 1999
Export Citation:
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Assignee:
HENKEL LOCTITE CORPORATION
International Classes:
B26D9/00; B24B27/06; B26F1/16; H05K3/00; (IPC1-7): H05K3/00
Domestic Patent References:
JP1058302A
JP11197928A
Attorney, Agent or Firm:
Fumio Iwahashi
Tomoyasu Sakaguchi
Hiroki Naito