Title:
CUTTING DEVICE FOR CUTTING SCRAP
Document Type and Number:
Japanese Patent JPH05337725
Kind Code:
A
Abstract:
PURPOSE: To provide a cutting device for cutting scrap, which is capable of cutting scrap from a clamping gap at a further reduced cost by inhibiting a scrap inserted in the clamping gap from deforming the cutting device so that the function of the cutting device is not lowered.
CONSTITUTION: This device includes a base 1 of the cutting device in which a blade slide 11 is vertically slid in slide guides 8, 9, 4 disposed on the base 1 of the cutting device, a first blade 10 supported by the blade slide 11 and a second blade 12 cooperating with the blade, wherein the blade slide 11 is moved against the action of an elastic member to form a wider shearing plane substantially perpendicularly to the shearing plane.
Inventors:
AHIMU BUEBERU
Application Number:
JP2142793A
Publication Date:
December 21, 1993
Filing Date:
February 09, 1993
Export Citation:
Assignee:
THYSSEN INDUSTRIE
International Classes:
B23D15/00; B23D15/04; B23D25/14; B23D31/00; B23D31/04; B23D35/00; B30B9/32; (IPC1-7): B23D15/04; B23D15/00; B23D25/14
Domestic Patent References:
| JPS571363A | 1982-01-06 | |||
| JP3047715B |
Attorney, Agent or Firm:
Mitsufumi Ezaki (3 others)