PURPOSE: To stably cut an ingot while supplying a coolant without using a grinder and reduce the loss of ingot at the time of cutting.

CONSTITUTION: This is a wafer cutting device to cut out a wafer 8 by cutting an ingot 1 with a cutting blade 5 of an inner peripheral blade cutter 6 while supplying a coolant 7 to the inner peripheral blade cutter 6, and in the neighbourhood of the inner peripheral blade cutter 6, a coolant wiper making contact with its side surface and wiping out the coolant 7 coming around on the surface side of the wafer 8 is provided. The coolant wiper 9 is provided so as to make contact with the outside in the radial direction rather than the cutting blade 5 of the side surface of the inner peripheral balde cutter 6. Consequently, it is possible to cut the wafer 8 stably in quality without damaging and breaking it. It is economical with little loss of the ingot 1. It is possible to increase cutting speed.