To provide a cutting device for cutting a lead wire extended from a bottom surface of an electronic part with high accuracy.
This cutting device comprises a cutting member abutment surface 84 having an insertion hole 82 for a lead wire 22 to be inserted to abut on a bottom surface 25 of a light emitting device 2, an upper blade 8 of which thickness size h to a cutting surface 85 where a tip of the lead wire 22 is protruded is set based on cut size of the lead wire 22, with polishing work applied to a cut surface 85 on the side where the tip of the lead wire 22 is protruded, a lower blade 4 having a slide surface 42 facing the cut surface 85, a guide rail 85 to guide the movement of the lower blade 4, and an air cylinder 5 to move the lower blade along the guide rail 85. The lead wire 22 is cut while it is held between the upper blade 8 and the lower blade 4.
Eiichi Tamura
Seiji Iga