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Title:
CUTTING DEVICE
Document Type and Number:
Japanese Patent JP2015174245
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a cutting device capable of removing unnecessary parts such as a gate part in the intermediate for molded article production by using a cutting process, and capable of mechanically removing the unnecessary parts from the intermediate for production and of inhibiting adherence of swarf to completed molded articles.SOLUTION: There is provided a cutting device 1 for removing a resin-made gate part 106 in the intermediate 100 for production of a completed molded article 101, formed by injection-molding a molten resin toward a cavity from a gate. The cutting device 1 has a cutting blade 15 which performs turning of the outer peripheral part of the gate part 106, and a drill 17 which collects the chips 108 generated by cutting the outer peripheral part of the gate part 106 by the cutting blade 15. The drill 17 is composed to hold the gate part 106 displaceably to the direction (upward) releasing the gate part 106 from an intermediate body 105.

Inventors:
TSUBAKI HARUYUKI
Application Number:
JP2014050558A
Publication Date:
October 05, 2015
Filing Date:
March 13, 2014
Export Citation:
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Assignee:
MITSUBOSHI BELTING LTD
International Classes:
B29C45/38
Domestic Patent References:
JP2002086512A2002-03-26
JPH1119981A1999-01-26
JPH06254899A1994-09-13
JPH045919U1992-01-20
JPH1119980A1999-01-26
JPH1024428A1998-01-27
JP2006297849A2006-11-02
JP2012130698A2012-07-12
JP2013206835A2013-10-07
JP2009126041A2009-06-11
Foreign References:
US5975882A1999-11-02
US20090224430A12009-09-10
Attorney, Agent or Firm:
Patent Corporation Wandee ip Partners



 
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