PURPOSE: To contrive the improvement of a working efficiency without stopping a rotating blade at each time of measurement by a method wherein when a cut work of a prescribed Si wafer or the like is obtained by cutting it out from an Si ingot, a measurement of the tension of a cutting edge is performed as the rotating cutting edge is in a state of rotation.
CONSTITUTION: First and second coolant nozzles 71 and 72 of a cutting edge tension measuring device of a slicing machine are arranged in opposition to the front and back of a cutting edge 46 provided at a cylindrical edge part 44b of a blade 44 and a coolant liquid of a prescribed set pressure is injected to clean through both faces of the cutting edge 46 through first and second flow rate control valves 73 and 74. These nozzles 71 and 72 perform a cleaning work of the cutting edge 46 in a continuous idle state subsequent to the completion of a cutting work of the number of prescribed sheets of Si ingots SI by the cutting edge 46. Moreover, either of the nozzles 71 and 72 is selectively formed in a drivable design, the nozzles 71 or 72 of either of the nozzles is controlled by a CPU (a central sequencer) 100 at the time of measurement of the tension of the blade 44 and a measurement of the tension of the cutting edge is made possible as the rotating cutting edge 64 is in a state of rotation.
YAMAZAKI YUKIO
KAWAGUCHI KEIJI
