Title:
切削装置
Document Type and Number:
Japanese Patent JP7028607
Kind Code:
B2
Abstract:
A cutting apparatus includes a rotatable holding table having a rectangular holding surface, a cutting unit having a cutting blade mounted to a rotatable spindle, and a sensor unit detecting a tip of the cutting blade entering between a light projection section and a light reception section. The sensor unit has an upper end located to be lower than a lower end of the holding table in a Z direction and is located below the axis of the spindle or an extension region of the axis, and when short sides of the rectangular holding surface are set parallel to a Y direction, an upper side of the sensor unit is opened to allow the cutting blade to enter between the light projection section and the light reception section.
Inventors:
Takatoshi Sakurai
Application Number:
JP2017213647A
Publication Date:
March 02, 2022
Filing Date:
November 06, 2017
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
B24B27/06; B24B41/06; B24B49/12; H01L21/301
Domestic Patent References:
| JP2007081101A | ||||
| JP2012169557A | ||||
| JP2015208783A |
Attorney, Agent or Firm:
Patent Business Corporation Tokyo Alpa Patent Office
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